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MIC61300
Low Input Voltage, Single-Supply High-Current LDO
General Description
The Micrel MIC61300 is a 3A output, low input voltage, single-supply regulator. This regulator operates over a single input voltage range of 1.1V to 3.6V and offers an ultra-low dropout less than 350mV over the entire operating temperature range. The MIC61300 is designed to drive digital circuits requiring low voltages at high currents such as DSPs, FPGAs, microcontrollers, etc. The regulator is available as a 1.0V fixed-output voltage option or as an adjustable-output voltage option. The MIC61300 is stable with a 47F, low-ESR ceramic output capacitor, and includes protection features such as thermal shutdown, current limiting and logic enable. The MIC61300 is offered in two different packages: a lowprofile, leadless 10-pin 3mm x 3mm MLF(R) and a 10-pin ePad MSOP. The MIC61300 has an operating junction temperature range of -40C to +125C. Data sheets and support documentation can be found on Micrel's web site at: www.micrel.com.
Features
* Single VIN rail: 1.1V to 3.6V * Output voltage accuracy: 2.5% over temperature * Typical dropout of 150mV at room temperature - Maximum dropout of 350mV at full load over temperature * Output voltage adjustable down to 0.5V * Soft-start control via external capacitor * Excellent line and load regulation * Logic controlled shutdown * Thermal-shutdown and current-limit protection * 10-pin 3mm x 3mm MLF(R) package * 10-pin ePad MSOP package * Junction temperature range from -40C to +125C
Applications
* Point-of-load applications * ASIC / Microprocessor power supply * FPGA power supply * Telecom / Networking cards * Wireless infrastructure ____________________________________________________________________________________________________________
Typical Application
Dropout Voltage vs. Output Current
200 DROPOUT VOLTAGE (mV)
V IN = 1.5V V FB = 0V TA = 25C
150
100
50
0 0.0 1.0 2.0 3.0 OUTPUT CURRENT (A)
MLF and MicroLeadFrame are registered trademarks of Amkor Technology, Inc. Micrel Inc. * 2180 Fortune Drive * San Jose, CA 95131 * USA * tel +1 (408) 944-0800 * fax + 1 (408) 474-1000 * http://www.micrel.com
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MIC61300
Ordering Information
Part Number MIC61300YMME MIC61300-10YMME MIC61300YML MIC61300-10YML Top Mark 61300 Z10J ZJ30 10ZJ Voltage Adjustable 1.0V Adjustable 1.0V Temperature Range -40C to +125C -40C to +125C -40C to +125C -40C to +125C Package ePad MSOP-10L ePad MSOP-10L 3mmx3mm MLF(R)-10L 3mmx3mm MLF -10L
(R)
Lead Finish Pb Free Pb Free Pb Free Pb Free
Pin Configuration
10-Pin ePad MSOP (MME)
10-Pin 3mm x 3mm MLF(R) (ML)
Pin Description
Pin Number 1, 2 3 4 5, 6 7 Pin Name IN GND EN NC CP FB 8 SENSE 9, 10 EP OUT GND Pin Function Input Voltage. Ground: Input and output return pin. Enable: Active-high control input that allows turn-on/-off of the LDO. No external function. Tie to ground. Internal Charge Pump Circuit Output: Connect a 0.1F to 1F capacitor from CP pin-to-GND to control the ramp rate of the output. Adjustable Regulator Feedback Input: Connect to the resistor voltage divider network that is placed from OUT pin to GND pin in order to set the output voltage. Fixed-Output Voltage Sense Input: Apply a Kelvin connection from this pin of the fixed output at the point-of-load to sense the output voltage level. Regulator Output: The output voltage is set by the resistor divider connected from VOUT to GND (with the divided connection tied to FB). A 47F ceramic capacitor with low ESR is required to maintain stability. See Applications Information. Connect to GND.
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Absolute Maximum Ratings(1, 2)
VIN to GND...................................................... -0.3V to 4.5V VCP to GND..................................................... -0.3V to 5.5V VOUT to GND ...................................................... -0.3V to VIN VSENSE to GND ................................................... -0.3V to VIN VEN to GND..................................................... -0.3V to 4.5V VFB to GND ........................................................ -0.3V to VIN Junction Temperature (TJ) ......................................... 150C Lead Temperature (soldering, 10 sec.)...................... 260C Storage Temperature (TS).........................-65C to +150C
Operating Ratings(3)
Supply Voltage (VIN)......................................... 1.1V to 3.6V Enable Voltage (VEN)...................................... -0.3V to 3.6V Output Voltage Range (VOUT)........................... 0.5V to 3.0V Ambient Temperature Range (TA) .............. -40C to +85C Junction Temperature (TJ) ........................ -40C to +125C Maximum Power Dissipation (PD) ............................. Note 4 Package Thermal Resistance 3mm x 3mm MLF-10L (JA) ............................60.7C/W ePad MSOP-10 (JA) ......................................76.7C/W
Electrical Characteristics(5)
VIN = VOUT + 0.4V; VEN = 1.1V; IOUT = 10mA; CCP = 0.1F; COUT = 47F; TJ = 25C. Bold values indicate -40C TJ +125C, unless noted. Parameter Power Supply Input Input Voltage Range (VIN) Ground Pin Current Ground Current in Shutdown Reference Feedback Pin Voltage (FB Pin) Output Voltage Accuracy (SENSE Pin) Load Regulation Line Regulation FB Pin Current Current Limit Current Limit Dropout Voltage Dropout Voltage (VIN - VOUT)
Notes: 1. 2. 3. 4. 5. 6. Exceeding the absolute maximum rating may damage the device. Devices are ESD sensitive. Handling precautions recommended. Human body model (HBM), 1.5k in series with 100pF. The device is not guaranteed to function outside its operating rating. PD(MAX) = (TJ(MAX) - TA) / JA, where JA, depends upon the printed circuit layout. See "Applications Information." Specification for packaged product only. VOUT (%) = (0.12) x VIN
(6)
Condition
Min. 1.1
Typ.
Max. 3.6
Units V mA A
IOUT = 3A; VIN = 1.4V IOUT = 3A; VIN = 3.6V VEN = 0V; VIN = 2V; VOUT = 0V
1.8 7.6 0.1 15 10
Adjustable Output
0.495 0.4875
0.500 0.500 0 0
0.505 0.5125 +1 +2.5 0.35 V % % %/V A
Fixed Output IOUT = 10mA to 3A VIN = (VOUT + 0.4V) to 3.6V VFB = 0.5V
-1 -2.5 -0.35 -0.2
0.12 0.01
0.2 1
VOUT = 0V
3.5
4.7
A
IOUT = 3A
150
350
mV
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Electrical Characteristics(5) (Continued)
VIN = VOUT + 0.4V; VEN = 1.1V; IOUT = 10mA; CCP = 0.1F; COUT = 47F; TJ = 25C. Bold values indicate -40C TJ +125C, unless noted. Parameter Enable Input EN Logic Level High EN Logic Level Low EN Hysteresis EN Pin Current Start-Up Time Minimum Load Current Minimum Load Current Thermal Protection Over-Temperature Shutdown Over-Temperature Shutdown Hysteresis TJ Rising 160 5 C C 10 mA VEN = 0.2V (Regulator Shutdown) VEN = 3.6V (Regulator Enabled) CCP = 0.1F; COUT = 10F VIN = 1.2V, VOUT = 0.5V 1.1 0.6 0.5 100 0.02 15 250 750 0.2 V V mV A s Condition Min. Typ. Max. Units
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Typical Characteristics
Dropout Voltage vs. Input Voltage
300 DROPOUT VOLTAGE (mV) 250 200 150 100 50 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 INPUT VOLTAGE (V) IOUT = 1.5A ADJUSTABLE OPTION VFB = 0V IOUT = 3A
GND Pin Current vs. Input Voltage
20 GROUND CURRENT (mA) 16 12 8 4 0 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VIN = VOUT + 0.4V IOUT = 3A
Shutdown Ground Current vs. Input Voltage
1.0 GROUND CURRENT (A) 0.8 0.6 0.4 0.2 0.0 1.0 2.0 3.0 4.0 VOUT = 0V VEN = 0V
IOUT = 100mA
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Feedback Voltage vs. Input Voltage
0.510 FEEDBACK VOLTAGE (V)
Feedback Pin Current vs. Input Voltage
30 FB PIN CURRENT (nA) 25 20 15 10 5 0 IOUT = 0A VFB = 0.5V
Load Regulation vs. Input Voltage
0.10 LOAD REGULATION (%)
VOUT = 1.0V 0.505 IOUT = 10mA
0.05
0.500
0.00 VOUT = 1.0V -0.05 IOUT = 10mA to 3A
0.495
0.490 1.0 1.5 2.0 2.5 3.0 3.5 4.0 INPUT VOLTAGE (V)
-0.10
1.0 1.5 2.0 2.5 3.0 3.5 4.0
1.0
1.5
2.0
2.5
3.0
3.5
4.0
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
Short-Circuit Current vs. Input Voltage
10
ENABLE PIN CURRENT (A)
20
Enable Pin Current vs. Input Voltage
10 CHARGE PUMP VOLTAGE (V) 8 6 4 2 0
1.0 1.5 2.0 2.5 3.0 3.5 4.0
Charge Pump Voltage vs. Input Voltage
CURRENT LIMIT (A)
8 6 4 2 0 1.0 1.5 2.0 2.5
VOUT = 0V
15
10 VOUT = 1.0V 5 IOUT = 10mA VEN = 3.6V
VOUT = 0.5V IOUT = 50mA
3.0
3.5
4.0
0 INPUT VOLTAGE (V)
0
1
2
3
4
INPUT VOLTAGE (V)
INPUT VOLTAGE (V)
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Typical Characteristics (Continued)
GND Pin Current vs. Temperature
5 GROUND CURRENT (mA) 4 3 2 1 0 -50 -20 10 40 70 100 130 TEMPERATURE (C) VOUT = 1.0V IOUT = 500mA
Shutdown Ground Current vs. Temperature
5 GROUND CURRENT (A)
1.50
VIN Turn-On Threshold vs. Temperature
VIN = 1.4V
VIN =1.5V
VIN THRESHOLD (V)
4 3 2 1 0 -50 -20 10 40
VOUT = 0V
1.25
1.00
0.75
0.50
70
100
130
-50
-20
10
40
70
100
130
TEMPERATURE (C)
TEMPERATURE (C)
EN Pin Current vs. Temperature
30
Dropout Voltage vs. Temperature
400 DROPOUT VOLTAGE (mV) VIN = 1.5V 300
CURRENT LIMIT (A) 10
Short Circuit Current vs. Temperature
VIN = 1.5V VOUT = 0V
EN PIN CURRENT (A)
25 20 15 10 5 0 -50 -20 10 40 70 100 130 TEMPERATURE (C) VIN = 1.5V VOUT = 1.0V VEN = 3.6V
VFB = 0V
8 6 4 2 0
200
IOUT = 3A
100
IOUT = 1A
0 -50 -20 10 40 70 100 130
-50
-20
10
40
70
100
130
TEMPERATURE (C)
TEMPERATURE (C)
Feedback Voltage vs. Temperature
0.510 FEEDBACK VOLTAGE (V) VIN = 1.5V IOUT = 10mA VOUT = 1.0V
Feedback Pin Current vs. Temperature
20
LINE REGULATION (%/V) 0.20
Line Regulation vs. Temperature
VIN = 1.1V to 3.6V 0.15 VOUT = 1.0V IOUT = 10mA
0.500
FB PIN CURRENT (nA)
0.505
15
10 VIN = 1.5V 5 VFB = 0.5V IOUT = 10mA
0.10
0.495
0.05
0.490 -50 -20 10 40 70 100 130 TEMPERATURE (C)
0 -50 -20 10 40 70 100 130 TEMPERATURE (C)
0.00 -50 -20 10 40 70 100 130 TEMPERATURE (C)
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Typical Characteristics (Continued)
Dropout Voltage vs. Output Current
300 DROPOUT VOLTAGE (mV)
FEEDBACK VOLTAGE (V) 0.510
Feedback Voltage vs. Output Current
5 GROUND CURRENT (mA)
VIN = 1.5V 0.505 VOUT = 1.0V
GND Pin Current vs. Output Current
VIN = 1.5V VOUT = 1.0V
250 200 150 100 50 0 0.0
VIN = 1.5V VFB = 0V TA =125C
4 3 2 1 0
TA = 85C
0.500
0.495
TA = 25C TA = -40C 1.0 2.0 3.0
0.490 0.0 1.0 2.0 3.0 OUTPUT CURRENT (A)
0.0
1.0
2.0
3.0
OUTPUT CURRENT (A)
OUTPUT CURRENT (A)
Line Regulation vs. Output Current
0.10
LINE REGULATION (%/V)
Power Dissipation vs. Output Current
2.0 POWER DISSIPATION (W)
Case Temperature* (ML) vs. Output Current
100
CASE TEMPERATURE (C)
VIN = 1.5V to 3.6V 0.05 VOUT = 1.2V
1.5
80 60 40 20 0 VIN = 1.5V VOUT = 1.0V
0.00
1.0
VOUT = 1.5V
-0.05
0.5
VOUT = 1.0V
-0.10 0.0 1.0 2.0 3.0 OUTPUT CURRENT (A)
0.0 0.0 1.0 2.0 3.0 OUTPUT CURRENT (A)
0.0
1.0
2.0
3.0
OUTPUT CURRENT (A)
10 OUTPUT NOISE (V/Hz)
Output Noise vs. Frequency
RIPPLE REJECTION (dB)
Noise Spectral Density
80 70 60 50 40 30 20 10 0 0.01
Ripple Rejection vs. Frequency
Gain (dB)
80 RIPPLE REJECTION (dB) 70 60 50 40 30 20 10 0 0.01
Ripple Rejection vs. Frequency
Gain (dB)
1
0.1
VIN =1.2V VOUT = 1.0V IOUT = 3A COUT = 47F
VIN =1.5V VOUT = 1.0V IOUT = 100mA COUT = 47F
VIN =1.5V VOUT = 1.0V IOUT = 1A COUT = 47F
0.01
0.001 0.01
0.1
1
10
100
1000
0.1
1
10
100
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
FREQUENCY (kHz)
Case Temperature*: The temperature measurement was taken at the hottest point on the MIC61300 case mounted on a 2.25 square inch PCB at an ambient temperature of 25C; see "Thermal Measurement" section. Actual results will depend upon the size of the PCB, ambient temperature and proximity to other heat emitting components.
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Functional Characteristics
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Functional Characteristics (Continued)
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Functional Characteristics (Continued)
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Functional Diagram
Figure 1. MIC61300 Block Diagram - Fixed
Figure 2. MIC61300 Block Diagram - Adjustable
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MIC61300 Input Capacitor A 10F ceramic input capacitor is all that is required for most applications. However, fast load transient and low headroom (VIN - VOUT) requires additional bulk bypass capacitance to ensure that the regulator does not drop out of regulation. The input capacitor must be placed on the same side of the board and next to the MIC61300 to minimize the dropout voltage and voltage ringing during transient and short circuit conditions. It is also recommended to use two vias for each end of the capacitor to connect to the power and ground plane. X7R or X5R dielectric ceramic capacitors are recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60% respectively over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic or a tantalum capacitor to ensure the same capacitance value over the operating temperature range. Tantalum capacitors have a very stable dielectric (10% over their operating temperature range) and can also be used in parallel with the ceramic capacitor(s). See Typical Characteristics section for examples of load transient response. Output Capacitor As part of the frequency compensation, the MIC61300 requires a 47F ceramic output capacitor. However, any other type of capacitor can be placed in parallel as long as the 47F ceramic output capacitor is placed next to the MIC61300. Output voltages below 0.8V require either a 100F or 2x 47F output capacitance for large output transients. The increased output capacitance reduces the output voltage drop caused by load transients, which increases as a percentage of the output voltage as the output voltage is lowered. The output capacitor type and placement criteria are the same as the input capacitor. See the Input Capacitor section for a detailed description. Minimum Load Current The MIC61300 requires a minimum load of 10mA to maintain output voltage regulation.
Functional Description
The MIC61300 is an ultra-high-performance, low-dropout linear regulator designed for high-current applications that require low input voltage operation. The MIC61300 operates from a single input supply and generates an internal supply that is higher than the input voltage to drive an on-chip N-Channel MOSFET. The N-Channel MOSFET significantly reduces the dropout voltage when compared to a traditional P-Channel MOSFET. P-Channel MOSFETs are usually used in single-supply low-dropout linear voltage regulators. However, for input voltages below 1.5V, there is not sufficient gate drive to turn on the P-Channel. To solve this issue, the MIC61300 uses a simple internal charge pump to drive the internal N-Channel MOSFET's gate higher than the input voltage, see Functional Diagram. The N-Channel MOSFET greatly reduces the dropout voltage for the same die area when compared to that of a P-Channel. Other added benefits of the charge pump include the ability to control the output voltage rise time and to improve the power supply rejection ratio (PSRR). This is accomplished by using the VCP supply to power the error amplifier. The other significant advantage of the MIC61300 over a P-Channel regulator is its transient response. The NChannel in the follower configuration is much faster than its P-channel counter part and is simpler to compensate. Any type of output capacitor can be placed in parallel with it as long as the minimum value output ceramic capacitor is placed next to the MIC61300. See the Output Capacitor section for specific details. Also, the regulator is fully protected from damage due to fault conditions by offering linear current limiting and thermal shutdown. Soft-Start Soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time will draw a lower input surge current. The CP pin is the output of the internal charge pump. The soft-start rise time is controlled by the external capacitor connected from CP pin-to-GND. During softstart, the charge pump feeds a current to CCP. The output voltage rise time is dependent upon the value of CCP, the input voltage, output voltage and the current limit. The value of the charge pump external capacitor selected is recommended in the range of 0.1F to 1F.
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Micrel, Inc. Adjustable Regulator Design The MIC61300 adjustable version allows programming the output voltage from 0.5V to 3.0V by placing a resistor divider network (R1, R2) from VOUT to GND (see Application Circuit). The high side of R1 should be connected at the point-of-load for high-accuracy Kelvin sensing. VOUT is determined by the following equation:
R1 VOUT = 0.5 x + 1 R2
MIC61300 Thermal Design Linear regulators are simple to use. The most complicated design parameters to consider are thermal characteristics. To help reduce the thermal resistance, the ePad (underneath the IC) should be soldered to the PCB ground and the placement of thermal vias either underneath or near the ePad is highly recommended. Thermal design requires the following applicationspecific parameters: * Maximum ambient temperature (TA) * Output current (IOUT) * Output voltage (VOUT) * Input voltage (VIN) * Ground current (IGND) First, calculate the power dissipation of the regulator from these numbers and the device parameters from this datasheet: PD = (VIN - VOUT) x IOUT + (VIN x IGND) Eq. 2 Eq. 3
Eq. 1
where VOUT is the desired output voltage. The resistor (R2) value between the FB pin and GND is selected to maintain a minimum 10mA load on the output. The resistor values are calculated from the previous equation, resulting in the following:
V R1 = R2 x OUT - 1 0.5
Table 1 is a list of resistor combinations to set the output voltage. A 1% tolerance is recommended for both R1 and R2. For a unity gain, 0.5V output voltage, connect the FB pin directly to the output.
VOUT 0.5V 0.6V 0.7V 0.8V 0.9V 1.0 1.1V 1.2V 1.5V 1.8V 2.2V R1 - 10.0 20.0 30.1 40.2 49.9 60.4 69.8 100 130 169 R2 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9 49.9
where the ground current is approximated by using numbers from the Electrical Characteristics or Typical Characteristics sections For example, given an expected maximum ambient temperature (TA) of 75C with VIN = 1.2V, VOUT = 0.9V, and IOUT = 1.5A, first calculate the expected PD using Equation 1: PD = (1.2V - 0.9V) x 1.5A + 1.2V x 0.015A = 0.468W Eq. 4 Next, determnine the junction temperature for the expected power dissipation above using the thermal resistance (JA) of the 10-pin 3mm x 3mm MLF(R) (YML) adhering to the following criteria for the PCB design: 1oz. copper and 100mm2 copper area for the MIC61300. TJ = (JA x PD) + TA = (60.7C/W x 0.468W) + 75C = 103.4C Eq. 5
Table 1. Resistor Selection for Specific VOUT
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Micrel, Inc. To determine the maximum power dissipation allowed that would not exceed the IC's maximum junction temperature (125C) when operating at a maximum ambient temperature of 75C by: PD(MAX) = (TJ(MAX) - TA) / JA = (125C - 75C) / (60.7C/W) = 0.824W Eq. 6
MIC61300 To avoid this messy thermal couple grease or glue, an infrared thermometer is recommended. Most infrared thermometers' spot size are too large for an accurate reading on small form factor ICs. However, an IR thermometer from Optris has a 1mm spot size, which (R) makes it ideal for the 3mm x 3mm MLF package. Also, get the optional stand. The stand makes it easy to hold the beam on the IC for long periods of time. Enable The MIC61300 features an active high enable input (EN) that allows ON/OFF control of the regulator. The current through the device reduces to near "zero" when the device is shutdown, with only microamperes of leakage current. The EN input may be directly tied to VIN or driven by a voltage that is higher than VIN as long as the voltage does not exceed the maximum operating rating of the EN pin.
Thermal Measurements It is always wise to measure the IC's case temperature to make sure that it is within its operating limits. Although this might seem like a very elementary task, it is very easy to get erroneous results. The most common mistake is to use the standard thermal couple that comes with the thermal voltage meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. There are two suggested methods for measuring the IC case temperature: a thermal couple or an infrared thermometer. If a thermal couple is used, it must be constructed of 36 gauge wire or higher to minimize the wire heatsinking effect. In addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact to the case of the IC. This thermal couple from Omega (5SC-TT-K-36-36) is adequate for most applications.
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MIC61300YML Evaluation Board Schematic (3mm x 3mm 10-Pin ePad MLF(R))
Bill of Materials
Item C1 C2 C3 R1 R2 R3 R4 U1
Notes: 1. Kemet: www.kemet.com. 2. TDK: www.tdk.com. 3. Murata: www.murata.com. 4. AVX: www.avx.com. 5. Vishay: www.vishay.com. 6. Micrel, Inc.: www.micrel.com.
Part Number C0805C106K8PACTU C3216X5ROJ476M GRM31Cr60J476ME19L 12066D476MAT2A C0603C104K8RACTU CRCW080569R8F CRCW080549R9F CRCW08051002F CRCW080500R0F MIC61300YML
Manufacturer Kemet
(1)
Description 10F/10V Ceramic Capacitor, X5R,Size 0805 47F/6.3V Ceramic Capacitor, X5R, Size 1206 or 47F/6.3V Ceramic Capacitor, X5R, Size 1206 or 47F/6.3V Ceramic Capacitor, X5R, Size 1206 0.1F/10V Ceramic Capacitor, X7R, Size 0603 69.8 Film Resistor, Size 0805, 1% 49.9 Film Resistor, Size 0805, 1% 10k Film Resistor, Size 0805, 1% 0 Film Resistor, Size 0805, 1% 3A Low-Voltage, Single-Supply LDO
Qty. 1 1 1 1 1 1 1 1
TDK(2) Murata(3) AVX
(4)
Kemet(1) Vishay Vishay Vishay
(5) (5) (5)
Vishay(5) Micrel, Inc.(6)
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MIC61300YML PCB Layout Recommendations
MIC61300YML Evaluation Board - Top Layer
MIC61300YML Evaluation Board - Bottom Layer
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MIC61300YMME Evaluation Board Schematic (10-Pin ePad MSOP)
Item C1 C2 C3 R1 R2 R3 R4 U1
Notes:
Part Number C0805C106K8PACTU C3216X5ROJ476M GRM31Cr60J476ME19L 12066D476MAT2A C0603C104K8RACTU CRCW080569R8F CRCW080549R9F CRCW08051002F CRCW080500R0F MIC61300YMME
Manufacturer Kemet(1) TDK
(2) (3)
Description 10F/10V Ceramic Capacitor, X5R,Size 0805 47F/6.3V Ceramic Capacitor, X5R, Size 1206 or 47F/6.3V Ceramic Capacitor, X5R, Size 1206 or 47F/6.3V Ceramic Capacitor, X5R, Size 1206 0.1F/10V Ceramic Capacitor, X7R, Size 0603 69.8 Film Resistor, Size 0805, 1% 49.9 Film Resistor, Size 0805, 1% 10k Film Resistor, Size 0805, 1% 0 Film Resistor, Size 0805, 1%
Qty. 1 1 1 1 1 1 1 1
Murata
AVX(4) Kemet(1) Vishay Vishay Vishay
(5) (5)
Vishay(5)
(5) (6)
Micrel, Inc.
3A Low-Voltage, Single-Supply LDO
1. Kemet: www.kemet.com. 2. TDK: www.tdk.com. 3. Murata: www.murata.com. 4. AVX: www.avx.com. 5. Vishay: www.vishay.com. 6. Micrel, Inc.: www.micrel.com.
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MIC61300YMME PCB Layout Recommendations
MIC61300YMME Evaluation Board - Top Layer
MIC61300YMME Evaluation Board - Bottom Layer
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Package Information
10-Pin 3mm x 3mm MLF(R) (ML)
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Package Information (Continued)
10-Pin e-PAD MSOP (MME)
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Landing Pattern
10-Pin 3mm x 3mm MLF(R) (ML)
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Landing Pattern (Continued)
10-Pin e-PAD MSOP (ME)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry, specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Micrel's terms and conditions of sale for such products, Micrel assumes no liability whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2010 Micrel, Incorporated.
September 2010
22
M9999-092910-A

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